Power chips are connected to outside circuits with product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is generally light weight aluminum bonding cable in typical modules. ^ Conventional power component bundle cross-section Currently, industrial silicon carbide power components still mainly use the product packaging technology of this wire-bonded traditional silicon IGBT component. They encounter problems such as large high-frequency parasitical...